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eBOX671-521-FL-DC-4PoEQ370, LGA1151 8/9th Gen, 2x GbE, 4x PoE

CPU	LGA1151 9th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W) LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
Chipset	Intel® Q370 Intel® C246 PCH (optional)
System Memory	2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
BIOS	AMI
COM	2 x RS-232/422/485
USB	4 x USB 3.1 Gen2 2 x USB 3.1 Gen1
Ethernet/PoE	2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM) 4 x Power over Ethernet (IEEE802.2at), up to 60W
Display	2 x DisplayPort via optional MXM kit 1 x HDMI 1 x DisplayPort 1 x DVI-I
Digital I/O	N/A
Audio	N/A
Storage	2 x 2.5" HDD drive bay (max. up 9.5 mm height) 1 x mSATA (enabled in BIOS setting)
Expansion	2 x Full-size PCI Express Mini Card slot (USB + PCIe signal) 2 x SIM slot 1 x Internal MXM 3.1 type A connector
Others	1 x Flexible I/O window (Default : 2 x DB9 half cut bracket) 4 x SMA-type antenna connector TPM 2.0
Power Supply	24 VDC
Watchdog Timer	255 levels, 1 to 255 sec.
Construction	Aluminum extrusion and heavy-duty steel, IP40
Operating Temperature	Without MXM module: -40°C to 60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W) -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W) With MXM module: -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
Relative Humidity	10% to 90%, non-condensing
Vibration	IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration)
Shock	Vibration Endurance IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis)
Dimensions (W x D x H)	280 x 210 x 80.5 mm (11.02" x 8.26" x 3.16")
Weight (net/gross)	4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
Certifications	CE, FCC Class A
EOS Support	Win 10 IoT, Linux
Software Support	AMS.AXView
Mounting	Wall mount kit DIN-rail kit

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INDUSTRIAL PC

eBOX671-521-FL-DC-4PoE

Q370, LGA1151 8/9th Gen, 2x GbE, 4x PoE

Product nr: 127267

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CPU	LGA1151 9th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W) LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
Chipset	Intel® Q370 Intel® C246 PCH (optional)
System Memory	2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
BIOS	AMI
COM	2 x RS-232/422/485
USB	4 x USB 3.1 Gen2 2 x USB 3.1 Gen1
Ethernet/PoE	2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM) 4 x Power over Ethernet (IEEE802.2at), up to 60W
Display	2 x DisplayPort via optional MXM kit 1 x HDMI 1 x DisplayPort 1 x DVI-I
Digital I/O	N/A
Audio	N/A
Storage	2 x 2.5" HDD drive bay (max. up 9.5 mm height) 1 x mSATA (enabled in BIOS setting)
Expansion	2 x Full-size PCI Express Mini Card slot (USB + PCIe signal) 2 x SIM slot 1 x Internal MXM 3.1 type A connector
Others	1 x Flexible I/O window (Default : 2 x DB9 half cut bracket) 4 x SMA-type antenna connector TPM 2.0
Power Supply	24 VDC
Watchdog Timer	255 levels, 1 to 255 sec.
Construction	Aluminum extrusion and heavy-duty steel, IP40
Operating Temperature	Without MXM module: -40°C to 60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W) -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W) With MXM module: -40°C to 50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
Relative Humidity	10% to 90%, non-condensing
Vibration	IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration)
Shock	Vibration Endurance IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis)
Dimensions (W x D x H)	280 x 210 x 80.5 mm (11.02" x 8.26" x 3.16")
Weight (net/gross)	4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
Certifications	CE, FCC Class A
EOS Support	Win 10 IoT, Linux
Software Support	AMS.AXView
Mounting	Wall mount kit DIN-rail kit

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eBOX671-521-FL-DC-4PoE

Q370, LGA1151 8/9th Gen, 2x GbE, 4x PoE